TaC Support Pedestal

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TaC Support Pedestal
Semicorex TaC Support Pedestal features an investment in the future MOCVD process imparting exceptional properties.**

While both CVD TaC coating and SiC coating find use in Metal-Organic Chemical Vapor Deposition (MOCVD) systems, CVD TaC coating offers certain advantages in this specific context:

Enhanced Chemical Resistance Brought with CVD TaC coating in MOCVD:

Semicorex TaC Support Pedestal exhibits superior inertness to a wider range of corrosive gases commonly employed in MOCVD processes while both CVD TaC coating and SiC coating significantly improve the chemical resistance of graphite components and CVD TaC coating, including halides, hydrides, and metalorganics. This exceptional chemical stability translates to a longer lifespan compared with CVD SiC for the TaC Support Pedestal, minimizing the need for frequent replacements and reducing downtime associated with maintenance for MOCVD equiments.

Elevated Temperature Performance Brought with CVD TaC coating:

MOCVD processes often operate at extremely high temperatures to achieve the desired film deposition rates and material properties. While SiC coatings offer good thermal stability, TaC Support Pedestal truly excel in this domain. Its CVD TaC coating maintains its structural integrity and desirable properties at even higher temperatures compared with CVD SiC without exhibiting significant degradation compared with CVD SiC, making it ideal for next-generation MOCVD equipment pushing the boundaries of thermal processing.

Density (gm/cm3)Emissivity(1)CTE (x10-6/K)Hardness (HK)Resistance (Ohm-cm)Thermal StabilityEtch Rate(2) in NH3 (μm/hr)Etch Rate(3) in H3 (μm/hr)Thickness VariationGraphite Dimension Change
TaC
14.3
0.3
6.3
2000
1x10-5
>2200 °C
0.2
0.1
~5%
~17 μm
SiC
3.2
0.8
4.5
2800
2x10-3
<1600 °C
1.5
1.7
~10%
~100 μm
 
 
Typical Property Comparison of CVD SiC Coating and TaC Coating
 

Minimized Particle Generation Brought with CVD TaC coating in MOCVD :

Controlling particulate contamination is paramount in MOCVD to ensure the deposition of high-quality, defect-free thin films. Both CVD TaC coating and SiC coating offer smoother surfaces compared to bare graphite, reducing particle generation. However, the inherent hardness and density of the TaC Support Pedestal provide a further advantage. CVD TaC coating is less prone to microscopic flaking or spalling compared with CVD SiC, even under prolonged exposure to harsh processing conditions in MOCVD, contributing to significantly lower particle levels within the reactor chamber and ultimately resulting in higher device yields.

Exceptional Purity for Brought with CVD TaC coating in MOCVD:

The purity of deposited films is paramount in semiconductor manufacturing, directly impacting device performance and reliability. While CVD SiC coatings generally maintain good purity levels, the TaC Support Pedestal exhibits exceptionally lower reactivity with precursor gases and reaction byproducts compared with CVD SiC in MOCVD. CVD TaC coating's inert nature minimizes the risk of unwanted impurities being incorporated into the deposited films, ensuring the highest levels of film purity and device performance.

Reduced Premature Cracking in MOCVD:

Lower Deposition Temperature: TaC deposition occurs at lower temperatures (700-900°C) compared to CVD SiC (900-1100°C). This is crucial for MOCVD components like susceptor lids, which undergo repeated thermal cycling. Lower deposition temperatures minimize thermal stress during coating and subsequent operation, reducing the risk of premature cracking, especially in complex geometries.

Better Thermal Expansion Match: CVD TaC' s thermal expansion coefficient (7.7 x 10^-6/K) is closer to that of common MOCVD substrate materials like graphite and quartz compared to CVD SiC (4-5 x 10^-6/K). This closer match further reduces thermal stress-induced cracking during operation.

Semicorex Isostatic Graphite SMX-HJTA-1 Exclusively for CVD TaC Coating
 

Properties

Unit

Semicorex
SMX-HJTA-1

SIGRAFINE
R6510

TOYO TANSO
IG310

Density

g/cm3

1.9 

1.83 

1.85 

Bending Strength

Mpa

78 

60 

49 

Compressive Strength

Mpa

130 

130 

103 

Hardness

HS

60 

64 

60 

Thermal Conductivity

W/(m·K)

145 

105 

130 

Electrical Resistivity

μΩ·m

9.0 

13 

10 

  Coefficient of Thermal Expansion

10-6/K

6.3 

4.2 

5 

Open Pore Diameter

μm

0.4 

1.8 

1.0