Edge Rings

 

Semicorex Edge Rings, also known as edge focus rings or edge energy rings, are precision-engineered components installed around the perimeter of electrostatic chucks (ESCs) within semiconductor etching chambers. Designed to endure the harsh environment of plasma bombardment, Edge Rings play a critical role in improving etching uniformity and maintaining process consistency throughout etching processes in integrated circuit (IC) fabrication.

Wafers are bombarded by high-energy ions during processing, and in a reactive gas atmosphere. Wafers are held in place using an electrostatic chuck (ESC), which holds the wafer electrically and provides thermal and electrical contact. In the area between the wafer, the wafer edge, and the ESC exposed surface, we experience non-uniform plasma distribution and energy dissipation. This edge effect can create depth variation in etching, incomplete patterns, and yield loss.

Edge Rings are designed to help with the concerns mentioned above. Edge Rings fit directly adjacent to the wafer on the ESC. Edge Rings are made from plasma resistance materials (silicon, quartz, advanced ceramics). Edge Rings fill the space around the wafer and helps to make a more symmetrical electric field and more uniform distribution of ions due to plasma exposure. This results in improved consistency of etching results from wafer center to edge, improved critical dimension (CD) control, and improved pattern fidelity.

The edge focusing ring is installed on the periphery of the electrostatic adsorption disk and withstands the plasma bombardment etching together with the wafer, making the etching electrical performance more uniform, ensuring the energy stability and wafer quality of the integrated circuit production process.

The CVD SiC parts in the etching equipment include focusing rings, gas shower heads, trays, edge rings, etc. Due to the low reactivity and conductivity of CVD SiC to chlorine-containing and fluorine-containing etching gases, it is an ideal material for focusing rings and other parts of plasma etching equipment.

Edge Rings come in a variety of custom geometries and materials for a diversity of wafer sizes, plasma chemistries, and chamber geometries. Whether used in deep reactive ion etching (DRIE), high-aspect-ratio patterning, and advanced logic and memory fabrication; Edge Rings play a critical role in high-throughput and high-precison etching process in semiconductor.

Semicorex Edge Rings profoundly improve uniformity stability, and reproducibility across semiconductor production etch processes. CVD SiC Edge Rings facilitate a stable, controllable plasma atmosphere outside of the wafer edge. Wire Ring applications strongly correlated with repeatable quality and improved device performance, making Edge Rings an essential component in advanced integrated circuits.