Thermal Insulator

Semicorex thermal insulator is made by advanced pitch-based carbon fiber composites, using the vapor deposition method. If high strength is required, we can do the carbonization and graphitization processes customized based on the requirements.

The material has excellent thermal stability and low thermal expansion coefficient, which is suitable for the high-temperature process for semiconductor fabrication equipment. Its good mechanical strength and the thermal conductivity balance, can efficiently reduce the wafer deforming by heating stress. And the complex structure can be formed through the precious machining, ensure providing stable heating shield effect in the plasma etching and CVD processes, to improve process repeatability and yield.

As semiconductor manufacturing becomes more precise, cleaner, and capable of higher temperatures, thermal insulators that offer low thermal conductivity and superior mechanical integrity are increasingly needed. Therefore, pitch-based carbon fiber composites are particularly well suited for these applications because of their high temperature tolerance, dimensional stability, and contamination-free operation. For this reason, they have become critical components in modern wafer fabrication, diffusion furnaces, epitaxial systems, and thermal management.

The high strain energy associated with the highly ordered, graphite-like structure of pitch-based carbon fibers provides the finished composite with enhanced thermal characteristics compared to traditional insulating materials. In addition to their extremely low thermal expansion rate and very high heat resistance, pitch-based carbon fibers allow the thermal insulator to retain its shape and function during rapid heating and cooling cycles. This characteristic is critical in semiconductor production, since precise temperature control and uniform thermal dispersion directly affect wafer quality, equipment life, and repeatability of processes. By adding mechanical rigidity to the composite structure, the insulator is able to withstand compression, vibration, and continuous extreme temperatures without deforming or breaching.

A composite made from pitch-based carbon fibers provides high strength at a low density, creating an excellent balance of durability and light weight. This combination allows for more efficient thermal insulator incorporation into complex semiconductor systems, where weight reduction results in smoother mechanical operation, lower stress on structural supports, and higher overall efficiencies. Additionally, pitch-based carbon fiber composites have superior toughness that results in a long service life, even in continuous high-temperature applications (CVD, LPCVD, MOCVD, and diffusion).
In semiconductor manufacturing, it is critical to have high chemical purity and stability. Pitch-based carbon fiber thermal insulators are naturally chemically inert and have a low tendency to outgas, thereby preventing contamination of the wafer surface or interference with sensitive processing stages. They can also be used in a variety of applications, including plasma systems, thermal reactors, ion implantation systems, and high-temperature transfer stations because they are compatible with both vacuum environments as well as many corrosive process gases.

Because the composite has an engineered (spacial) fiber structure with directional thermal properties, thermal conductivity can be controlled precisely by controlling the thermal flow through the composite. In other words, a manufacturer can make an insulator with a very low thermal resistance in one direction, but with an optimized pathway for heat conduction in either direction. The direction of heat is determined by how the composite is used in a semiconductor tool. This property is valuable when there is a need for localized heat shielding or directed thermal management.

Pitch-based carbon fiber insulation felt can be made into almost any shape or size (i.e., plate, ring, sleeve, block, spacer, or customer-defined geometries). The insulation felt is machined to tight tolerances, ensuring repeatable performance throughout multiple production cycles. When properly designed, these custom products integrate perfectly into high-temperature wafer furnaces, susceptors, thermal liners, and other thermal management products that require long-lasting dimensional integrity.