Zirconia Ceramic Nozzle
Material Advantages: The Foundation for Superior Performance
Semicorex Zirconia Ceramic Nozzle possesses a unique combination of properties that make it ideally suited for demanding nozzle applications:
Exceptional Hardness and Wear Resistance: The Zirconia Ceramic Nozzle is renowned for its extreme hardness and resistance to abrasive wear. This exceptional durability allows it to withstand the erosive forces of high-velocity particle streams, ensuring long nozzle life and consistent performance even when handling highly abrasive materials.
High-Temperature Stability and Strength: The Zirconia Ceramic Nozzle maintains its strength and dimensional stability at elevated temperatures, making it suitable for applications involving molten metals, high-temperature gases, and aggressive chemical environments where other materials would soften or degrade.
Chemical Inertness and Corrosion Resistance: The Zirconia Ceramic Nozzle leverages exceptional resistance to a wide range of acids, alkalis, and corrosive chemicals. This inertness makes it ideal for handling corrosive materials, preventing nozzle degradation and ensuring the purity of the dispensed material.
Smooth, Low-Friction Surface: The Zirconia Ceramic Nozzle can be polished to a smooth, low-friction surface finish. This smoothness reduces material buildup and clogging within the nozzle, ensuring consistent flow rates and precise dispensing accuracy.
| Item | Unit | Zirconia |
|---|---|---|
| Main Content | - | ZrO2 >94.5% |
| Color | - | White |
| Density | g/cm³ | 5.95 |
| Vickers Hardness | GPa | 12 |
| Flexural Strength | MPa | 800 |
| Compressive Strength | MPa | 2500 |
| Electrical Resistivity | Ω.cm | >10¹⁰ |
| Dielectric Strength | KV/mm | 9 |
| Dielectric Constant (1MHz) | - | 28 |
| Thermal Conductivity | W/m.K | 2.2 |
| Max Working Temperature | °C | 800 |
| Resistance | ΔT(°C) | 260 |
| Thermal Expansion Coefficient (25-1000°C) | 10⁻⁶/°C | 11-13 |
Potential Applications:
High-Temperature Chemical Vapor Deposition (CVD): The Zirconia Ceramic Nozzle's high-temperature stability and resistance to corrosive gases could be beneficial in certain CVD processes, particularly those involving high temperatures or aggressive precursor gases where other ceramics might degrade.
Wafer Cleaning and Etching: The Zirconia Ceramic Nozzle's chemical resistance and hardness make it suitable for handling aggressive chemicals used in wafer cleaning and etching processes. However, the extremely smooth surfaces required in semiconductor processing might pose a challenge for conventional zirconia ceramics, potentially requiring specialized surface treatments or coatings.
Atomizing Liquid Precursors: The Zirconia Ceramic Nozzle could be used for atomizing liquid precursors used in thin-film deposition processes. Their chemical inertness and ability to withstand high temperatures would be advantageous in applications requiring precise control over droplet size and distribution.
Handling of Specific Chemicals: The Zirconia Ceramic Nozzle's resistance to certain chemicals, such as hydrofluoric acid (HF), which is commonly used in semiconductor fabrication, might make the Zirconia Ceramic Nozzle suitable for handling these specific chemicals in specialized applications.
